Method and apparatus for damping vibrations in a semiconductor wafer handling arm

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United States of America Patent

PATENT NO 6761085
SERIAL NO

10068594

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A vibration damper for a semiconductor wafer handling arm includes a spring and a mass coupled to the spring to form a mass spring system that is tuned to vibrate at a structural resonant frequency of the vibrating wafer handling arm. The spring has temperature insensitive spring characteristics and the mass and spring are constructed of materials that do not outgas or produce contaminants in a semiconductor processing environment. The mass spring system is preferably a cantilever beam spring connected to a high response point on the vibrating arm and oriented to vibrate in a plane perpendicular to the plane of the wafer. The mass is preferably slidably adjustable along the length of the cantilever beam spring to adjust the resonant frequency of the vibration damper. Vibration damping of the wafer handling arm is accomplished by the transfer of kinetic energy from the vibrating wafer handling arm to the mass spring system.

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Patent Owner(s)

Patent OwnerAddress
NOVELLUS SYSTEMS INC3970 NORTH FIRST STREET SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tan, Mark Santa Clara, CA 7 32

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