Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 13, 2004
Issued Date -
N/A
app pub date -
Mar 1, 2002
filing date -
Feb 25, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-layer solid structure and method for forming a thermal interface between a microelectronic component package and a heat sink so that the structure has a total thermal resistance of no greater than about 0.03.degree. C.-in.sup.2 /W at a pressure of less than 100 psi. The structure comprises at least two metallic layers each of high thermal conductivity with one of the two layers having phase change properties for establishing low thermal resistance at the interface junction between the microelectronic component package and the heat sink.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully