Integrated thin film capacitor/inductor/interconnect system and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6761963
APP PUB NO 20020089810A1
SERIAL NO

09960796

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. The disclosed method first employs a thin metal layer (0502) deposited and patterned on the substrate (0501). This thin patterned layer (0502) is used to provide both lower electrodes for capacitor structures (0603) and interconnects (0604) between upper electrode components. Next, a dielectric layer (0705) is deposited over the thin patterned layer (0502) and the dielectric layer (0705) is patterned to open contact holes (0806) to the thin patterned layer. The upper electrode layers (0907, 0908, 1009, 1010) are then deposited and patterned on top of the dielectric (0705).

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
Ultrasource, Inc.HOLLIS, NH0

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Casper, Michael D 2 Carol Ann La., Amherst, NH 03031-3335 6 91
Mraz, William B 67 Bald Hill Rd., Newfield, NH 03856-8101 10 116

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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NEC CORPORATION (5)
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RENESAS ELECTRONICS CORPORATION (2)
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GENERAL ELECTRIC COMPANY (3)
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3M INNOVATIVE PROPERTIES COMPANY (1)
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LUCENT TECHNOLOGIES INC. (2)
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5781081 LC-type dielectric filter having an inductor on the outermost layer and frequency adjusting method therefor 11 1996
 
BLACKBERRY LIMITED (1)
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FUJITSU LIMITED (4)
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ITT CORPORATION (1)
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KYOCERA MITA CORPORATION (1)
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Nippon Electric Co., Ltd. (2)
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North American Philips Corporation (1)
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TEXAS INSTRUMENTS INCORPORATED (3)
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ROHM CO., LTD. (1)
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MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
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* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
SHARP KABUSHIKI KAISHA (1)
* 2007/0102,727 Field-effect transistor 28 2006
 
HITACHI HIGH-TECHNOLOGIES CORPORATION (2)
* 9805915 Plasma processing apparatus 0 2011
* 2012/0145,322 PLASMA PROCESSING APPARATUS 1 2011
 
STATS CHIPPAC PTE. LTE. (11)
7851257 Integrated circuit stacking system with integrated passive components 4 2006
* 2007/0114,651 INTEGRATED CIRCUIT STACKING SYSTEM WITH INTEGRATED PASSIVE COMPONENTS 30 2006
* 8669637 Integrated passive device system 0 2006
* 2007/0114,634 INTEGRATED PASSIVE DEVICE SYSTEM 19 2006
8188590 Integrated circuit package system with post-passivation interconnection and integration 0 2007
* 2007/0284,726 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH POST-PASSIVATION INTERCONNECTION AND INTEGRATION 9 2007
8791006 Semiconductor device and method of forming an inductor on polymer matrix composite substrate 0 2010
9685495 Semiconductor device and method of forming IPD on molded substrate 0 2012
8951904 Integrated circuit package system with post-passivation interconnection and integration 1 2012
9449925 Integrated passive devices 0 2013
9548347 Semiconductor device and method of forming an inductor on polymer matrix composite substrate 0 2014
 
AVX CORPORATION (5)
* 9450556 Thin film surface mount components 0 2010
* 2011/0090,665 THIN FILM SURFACE MOUNT COMPONENTS 4 2010
* 9755609 Thin film surface mount components 0 2016
* 9722568 Thin film surface mount components 0 2016
* 2016/0344,365 THIN FILM SURFACE MOUNT COMPONENTS 0 2016
 
Ultrasource, Inc. (8)
* 6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
* 2004/0080,021 Integrated thin film capacitor/inductor/interconnect system and method 15 2003
7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2005/0175,938 Integrated thin film capacitor/inductor/interconnect system and method 3 2005
7425877 Lange coupler system and method 1 2005
* 2005/0162,236 Lange coupler system and method 2 2005
* 7446388 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2006/0097,344 Integrated thin film capacitor/inductor/interconnect system and method 0 2005
 
INTEL CORPORATION (1)
* 7535080 Reducing parasitic mutual capacitances 62 2005
 
STATS CHIPPAC LTD. (1)
* 2010/0171,194 Semiconductor Device and Method of Forming an Inductor on Polymer Matrix Composite Substrate 3 2010
 
THIN FILM ELECTRONICS ASA (3)
* 8296943 Method for making surveillance devices with multiple capacitors 0 2009
* 2010/0123,582 Surveillance Devices with Multiple Capacitors 7 2009
8912890 Surveillance devices with multiple capacitors 0 2012
 
RENESAS ELECTRONICS CORPORATION (1)
* 2016/0260,795 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 0 2016
 
AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT (1)
* 2009/0184,090 THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY 12 2009
 
STMICROELECTRONICS SA (1)
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ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
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* Cited By Examiner