Integrated thin film capacitor/inductor/interconnect system and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6761963
APP PUB NO 20020089810A1





Loading Importance Indicators... loading....


See full text

A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. The disclosed method first employs a thin metal layer (0502) deposited and patterned on the substrate (0501). This thin patterned layer (0502) is used to provide both lower electrodes for capacitor structures (0603) and interconnects (0604) between upper electrode components. Next, a dielectric layer (0705) is deposited over the thin patterned layer (0502) and the dielectric layer (0705) is patterned to open contact holes (0806) to the thin patterned layer. The upper electrode layers (0907, 0908, 1009, 1010) are then deposited and patterned on top of the dielectric (0705).

Loading the Abstract Image... loading....

First Claim

See full text


Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
Ultrasource, Inc.HOLLIS, NH0

International Classification(s)


Inventor Name Address # of filed Patents Total Citations
Casper, Michael D 2 Carol Ann La., Amherst, NH 03031-3335 6 96
Mraz, William B 67 Bald Hill Rd., Newfield, NH 03856-8101 10 125

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation