Assembly of semiconductor device and wiring substrate
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United States of America Patent
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Jul 13, 2004
Grant Date -
Sep 18, 2003
app pub date -
Jan 7, 2003
filing date -
Jan 7, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Apparatus and method for assembling a semiconductor device on a wiring substrate is disclosed, wherein Pb (lead) is not used and the chance of generation of defects is reduced. Semiconductor package (100) has solder balls (114) containing Sn (tin), Ag (silver) and Cu (copper). Wiring substrate 200 has connecting terminals 208 for connecting solder balls (114). The connecting terminals (208) have an Au (gold) layer (212) and a Ni layer (210). In the operation for assembling semiconductor package (100) onto wiring substrate (200), because solder balls (114) are heated and fixed on connecting terminals (208), Au in Au layer (212) diffuses into balls (114). Because Au is contained in solder balls (114), a high bonding strength is obtained, and the chance of generation of defects is reduced.
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