Electro-optical package with drop-in aperture
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United States of America Patent
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Jul 13, 2004
Grant Date -
May 16, 2002
app pub date -
Nov 9, 2001
filing date -
Nov 16, 2000
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A drop-in aperture 20, which improves the performance and lowers the cost of electro-optical SLM packages. The disclosed package provides a separate metal light shield (aperture) 20 and antireflective coated cover 33, and positions the aperture 20 inside the package 40 in close proximity to the SLM's 41 surface. This approach further uses an on-chip SLM light shield to define the projected screen border, thereby making the edge definition of the metal drop-in aperture less critical. Therefore, the cover can be mounted well away from the plane of the SLM, which relaxes the defect requirements of the cover and lowers the cost of the overall package. The package of this invention improves the performance and lifetime and lowers the cost of projection display systems.
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