Copper-nickel-silicon two phase quench substrate
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United States of America Patent
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Jul 20, 2004
Grant Date -
Jun 17, 2004
app pub date -
May 17, 2002
filing date -
May 17, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.
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