Method of assembling and testing an electronics module
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United States of America Patent
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Jul 20, 2004
Grant Date -
Mar 13, 2003
app pub date -
Sep 12, 2001
filing date -
Sep 12, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronics module is assembled by demountably attaching integrated circuits to a module substrate. The module is then tested at a particular operating speed. If the module fails to operate correctly at the tested speed, the integrated circuit or circuits that caused the failure are removed and replaced with new integrated circuits, and the module is retested. Once it is determined that the module operates correctly at the tested speed, the module may be rated to operate at the tested speed and sold, or the module may be tested at a higher speed.
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