Chamber for uniform substrate heating
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United States of America Patent
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Jul 20, 2004
Grant Date -
Jul 4, 2002
app pub date -
Dec 18, 2001
filing date -
Dec 29, 2000
priority date (Note) -
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Abstract
Embodiments of the invention generally provide an apparatus and a method for providing a uniform thermal profile to a plurality of substrates during heat processing. In one embodiment, a cassette containing one or more heated substrate supports is moveably disposed within a heating chamber having an about uniform thermal profile therein to more uniformly heat the substrates.
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