Microelectronic adaptors, assemblies and methods
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 20, 2004
Grant Date -
Feb 5, 2004
app pub date -
Sep 6, 2002
filing date -
Aug 5, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A first microelectronic element such as a semiconductor chip is mounted to a circuit board using an adaptor which has a region extending beneath the first microelectronic element and an additional region which may be folded over the first microelectronic element or which may project laterally from the first microelectronic element. The adaptor includes a functional element in the additional region, such as a further microelectronic element or an array of terminals for mounting another element. The assembly provides the benefits of a stacked chip assembly or other mustachio module, but can be made without the need for a special prepackaged stacked chip assembly. The adaptor can be configured so that it does not materially increase the height of the first microelectronic element above the circuit board.
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