IC package with dual heat spreaders
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United States of America Patent
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-
Jul 20, 2004
Grant Date -
Dec 12, 2002
app pub date -
Aug 14, 2002
filing date -
Sep 1, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of making an integrated circuit device using an encapsulated semiconductor die having leads extending therefrom and attaching a heat spreader to each of the major outer encapsulant surfaces thereof. One or both of the heat spreaders has a pair of end posts configured for allowing further encapsulation of portions thereof and insertion into through-holes in a substrate to position and support the device during and following the outer lead solder reflow step at board assembly. The heat spreaders provide high heat dissipation and EMR shielding, and may be connected to the substrate ground to become ground planes.
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