Micro-relay
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United States of America Patent
Stats
-
Jul 20, 2004
Grant Date -
N/A
app pub date -
Feb 11, 2002
filing date -
Feb 4, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microstructure relay is provided, having a body that includes upper and lower portions. The lower portion is formed from a substrate, and the upper portion is formed on the substrate to avoid bonding of the lower portion to the upper portion. A support member is fixed to the body at a first end of the support member to form a cantilever, wherein an upper surface of the support member and a lower surface of the upper portion of the body form a cavity. A first contact region is located on the upper surface at a second end of the support member. The first contact region comprises a first contact, wherein pivoting the support member toward the lower surface causes the first contact to be electrically coupled to a counter contact.
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