Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication
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United States of America Patent
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Jul 27, 2004
Issued Date -
N/A
app pub date -
Feb 18, 2003
filing date -
Nov 30, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.
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