High density internal ball grid array integrated circuit package
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United States of America Patent
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Jul 27, 2004
Grant Date -
N/A
app pub date -
Jul 14, 1998
filing date -
Jan 23, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit package (30) comprising a substrate (70) having peripheral openings (86) and first and second surfaces (92, 94), a plurality of routing strips (82) being integral with the substrate (70), a plurality of pads (100) centrally disposed on the first surface (92) and electrically connected with at least one of the routing strips (82), a chip (50) having bonding pads (120) adhered to the second surface (84) of the substrate (70), wire bonding (80) electrically connecting at least one bonding pad (120) to at least one of the routing strips (82) and potting material (90) filling the openings (86) to adhere the chip (50) to the substrate (70) and surrounding the wire bonding (80), is disclosed.
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