Electronic module for chip card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 3, 2004
Grant Date -
Sep 12, 2002
app pub date -
May 9, 2002
filing date -
Mar 27, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention concerns an electronic module that is designed to be fixed in an electronic device in the form of a card. The module includes a medium having at least a surface provided with contact pads and a microcircuit which is fixed on the medium and has exit hubs each connected to a medium contact pad. The connections between the exit hubs and the contact pads consist of a cord made of an adhesive conductive substance which conforms to the profile of the medium. Preferably, the conductive substance is a conductive isotropic adhesive.
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