Resin/copper/metal laminate and method of producing same
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United States of America Patent
Stats
-
Aug 3, 2004
Grant Date -
May 23, 2002
app pub date -
Aug 11, 1998
filing date -
Aug 11, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A laminate for use in production of printed circuit boards comprising a metal layer having a first side and a second side; a metallic substrate, one side of the metallic substrate being attached to the first side of the metal foil; an adhesive substrate formed of a polymeric material having a first surface and a second surface, the first surface being attached to the second side of the copper foil, the adhesive substrate being at least partially uncured; and a releasable protective film along the second surface of the adhesive substrate.
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