High frequency device packages and methods

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United States of America Patent

PATENT NO 6770822
APP PUB NO 20030159262A1
SERIAL NO

10081565

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Abstract

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A high frequency device packing method and package are described wherein coaxial structures are formed from the high frequency device to the via. A coaxial via structure and a micro-coaxial bonding wire are described.

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Patent Owner(s)

  • ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cahill, Sean Palo Alto, CA 14 377
Hom, Bance Reno, NV 2 91
Pasternak, Eliezer Palo Alto, CA 29 1736

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