Process for manufacturing copper foil on a metal carrier substrate
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United States of America Patent
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-
Aug 3, 2004
Grant Date -
Aug 14, 2003
app pub date -
Feb 13, 2002
filing date -
Feb 13, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for forming a relatively thin releasable layer of copper on a carrier substrate. First, a separation facilitating layer is provided on the carrier substrate. A layer of vapor-deposited copper is then formed over the separation facilitating layer to protect the separation facilitating layer during subsequent processing. Thereafter, the thickness of the copper layer is increased by the electrodeposition of copper onto the vapor-deposited layer. The copper layer is applied to a dielectric and is released from the carrier substrate at the separation facilitating layer.
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