Importance

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Abstract

An interposer in a BGA or similar package includes a polymide core and a filler of thermally conductive, electrically nonconductive filler. The interposer has a higher thermal conductivity as compared to conventional interposers, thereby increasing the thermal dissipation through the interposer and enabling the device to cool more efficiently. The filler also reduces the coefficient of thermal expansion of the interposer to more closely match the die and reduce stresses. Furthermore, the filler increases the rigidity of the interposer, thereby enabling the interposer to be handled and carried more easily, for example, without a metal frame carrier.

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