Resistor component with multiple layers of resistive material
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United States of America Patent
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-
Aug 3, 2004
Grant Date -
Apr 25, 2002
app pub date -
Aug 2, 2001
filing date -
Sep 22, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A resistor foil, comprised of a copper layer having a first side and a second side. An intermediate layer having a thickness of between 5 .ANG. and 70 .ANG. is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 50 .ANG. and 2 .mu.m is disposed on the intermediate layer, and a second layer of a second resistor metal having a thickness of between 50 .ANG. and 2 .mu.m is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
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