Importance

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Abstract

A package for optical micro-mechanical devices including a die with one or more optical micro-mechanical devices on a first surface of a substrate. The first surface includes a die reference surface. One or more optical interconnect alignment mechanisms are formed in the first surface of the die. The optical interconnect alignment mechanisms are positioned to optically couple an optical interconnect with one or more of the optical micro-mechanical devices on the die. A package frame including an aperture and a package frame reference surface proximate the aperture is adapted to receive the die reference surface such that the optical micro-mechanical devices are located in the aperture. One or more optical interconnect alignment mechanisms are formed in the package frame. The optical interconnect alignment mechanisms on the package frame are positioned to align with corresponding optical interconnect alignment mechanisms on the die when the die reference surface is engaged with the package frame reference surface.

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First Claim