Apparatus for polishing periphery of device wafer and polishing method
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United States of America Patent
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-
Aug 10, 2004
Grant Date -
Nov 7, 2002
app pub date -
Apr 4, 2002
filing date -
May 2, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
When a device wafer is chucked and is rotated about an axis thereof, arc-shaped work faces of first and second inclined-face-polishing members are brought into line-contact with inclined faces disposed at front and rear faces, respectively, of the device wafer, the arc-shaped work face of a peripheral-face-polishing member is brought into line-contact with a peripheral face of the device wafer, and a disc-shaped work face of a peripheral-edge-polishing member is brought into planar contact with the front face of the device wafer at a peripheral edge thereof, whereby the inclined faces, the peripheral face, and the peripheral edge are polished simultaneously by the respective polishing members. Thus, an unnecessary part of a metallic film is removed from the periphery of the device wafer.
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