High speed embossing and adhesive printing process and apparatus
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United States of America Patent
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Aug 10, 2004
Grant Date -
Sep 12, 2002
app pub date -
Jan 10, 2002
filing date -
Apr 9, 1999
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention relates to a high speed embossing and adhesive printing process, said process comprising the steps of (a) applying an adhesive to a conformable heated glue application roll; (b) applying said adhesive to a first patterned embossing roll, having an outer surface, which is engaged with a second patterned embossing roll having a complementary pattern to said first embossing roll; (c) passing a web of sheet material between said first and second embossing rolls at a tangential line speed to simultaneously emboss said web and apply said adhesive to said web, such that said adhesive forms an adhesive pattern between embossments; and (d) applying a renewable release agent to the outer surface of the first patterned embossing roll.
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Cited Art Landscape
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