Connection components with posts
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United States of America Patent
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Aug 10, 2004
Issued Date -
N/A
app pub date -
Mar 27, 2002
filing date -
Dec 29, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A subtractively created interconnection scheme and apparatus, typically used with microelectronic devices, wherein a flexible support structure is attached to a conductive sheet. The conductive sheet is then selectively removed, preferably using an etching process, thereby producing a plurality of posts with tips which are substantially coplanar with respect to one another. Each post becoming an individual interconnection between the microelectronic device and a supporting substrate.
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