Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device
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United States of America Patent
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Aug 10, 2004
Grant Date -
Dec 19, 2002
app pub date -
May 21, 2002
filing date -
May 21, 2001
priority date (Note) -
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Abstract
The invention relates to an electronic device having a semiconductor chip and a leadframe. The leadframe has a flat conductor frame. A semiconductor chip connection plate is configured in the center of the flat conductor frame. The semiconductor chip connection plate is structured by elongate openings all around the position of the semiconductor chip to form an island that carries the semiconductor chip and a ring that surrounds the island. Furthermore, the invention relates to a method for producing such an electronic device and to a corresponding leadframe.
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