Abrasive pad for CMP
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 17, 2004
Grant Date -
Jan 8, 2004
app pub date -
Jan 2, 2003
filing date -
Aug 14, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An abrasive pad for CMP has a substrate and an abrasive layer disposed on the substrate. An abrasive pad for CMP having a substrate and an abrasive layer disposed on the substrate, wherein said abrasive layer has a three-dimensional structure including a plurality of regularly arranged three-dimensional elements having a predetermined shape, and said abrasive layer comprises an abrasive composite containing advanced alumina abrasive grains produced by a CVD method and a binder as construction components.
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