Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
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United States of America Patent
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Aug 17, 2004
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app pub date -
Feb 11, 2002
filing date -
Feb 11, 2002
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Abstract
The invention provides a chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a positively charged polyelectrolyte with a molecular weight of about 15,000 or more, wherein the abrasive comprises particles that are electrostatically associated with the positively charged electrolyte.
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