Crosslinked pressure sensitive adhesive compositions, and adhesive articles based thereon, useful in high temperature applications
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United States of America Patent
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Aug 17, 2004
Grant Date -
Sep 19, 2002
app pub date -
Nov 30, 2001
filing date -
Dec 1, 2000
priority date (Note) -
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Abstract
Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures.
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