Stacked semiconductor chips on a wiring board
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United States of America Patent
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-
Aug 17, 2004
Grant Date -
May 8, 2003
app pub date -
Dec 17, 2002
filing date -
Sep 7, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes: a wiring board; a first semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which is electrically connected to the wiring board via a raised electrode, the circuitry side of the first chip facing the principal surface of the wiring board; and a second semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which includes an external electrode on the circuitry side thereof. The non-circuitry sides of the first and second semiconductor chips are secured to each other. The external electrode of the second semiconductor chip is connected to the wiring board via a metal fine wire. The external and raised electrodes are so disposed as not to overlap each other as viewed vertically downward from over the principal surface of the wiring board.
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