Semiconductor device and method of manufacturing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 17, 2004
Issued Date -
N/A
app pub date -
Mar 31, 2003
filing date -
Mar 17, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
First pad electrodes for connection to leads and second pad electrodes for an internal interface, are provided over a main surface of a first LSI chip. Third pad electrodes of a second LSI chip and the second pad electrodes of the first LSI chip are respectively electrically connected to one another by wires. Circuits required as for a system LSI, which are not included in the LSI chip, are placed over the LSI chip, to implement a desired function used as for the system LSI by the two LSI chips. The system LSI is easily implemented by a semiconductor device wherein a plurality of LSI chips are sealed with a resin.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully