Device for specific particle manipulation and deposition
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United States of America Patent
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Aug 17, 2004
Grant Date -
Oct 2, 2003
app pub date -
Mar 31, 2003
filing date -
Apr 2, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for manipulating particles distributed substantially non-uniformly in a plasma of a carrier or reaction gas, wherein Coulomb interaction between the particles is so low that the particles substantially do not form a plasmacrystalline state, and the particles are exposed in a location-selective manner to external adjustment forces and/or the plasma conditions are subjected to a location-selective change to apply at least a portion of the particles onto a substrate surface mask-free and/or subject it to a location-selective plasma treatment in the carrier or reaction gas.
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