Telecommunication relay array for DSL network configuraton
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United States of America Patent
Stats
-
Aug 17, 2004
Grant Date -
Dec 12, 2002
app pub date -
Mar 14, 2002
filing date -
Mar 15, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This invention provides an electromagnetic relay formed on a substrate (1), preferably a multi-layer printed circuit board. The magnetic circuit (4, 5, 6a, 6b, 7a, 7b) passes through holes (2, 3) in the substrate, and is formed using printed circuit manufacturing techniques, such as electroplating to manufacture the plated through holes. The armature 7b is formed by depositing the armature material on a temporary layer, which is then removed.
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