Resilient contact structures for interconnecting electronic devices
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United States of America Patent
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Aug 17, 2004
Issued Date -
N/A
app pub date -
Dec 22, 2000
filing date -
Nov 16, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Resilient contact structures provide electrical interconnection between a semiconductor die and another electronic component. Multilayered packaging may be formed on the semiconductor die, and the resilient contact structures may be formed on portions of one or more of the layers. Heat dissipating structures may be provided on the die.
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