Flow sensor and method for producing the same
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United States of America Patent
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Aug 24, 2004
Grant Date -
Jan 1, 2004
app pub date -
Apr 3, 2003
filing date -
Apr 3, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a flow sensor comprising a substrate with integrated heat source and temperature sensors. Solder bumps are arranged on the heat source and the temperature sensors and the substrate is attached to the outside of a tube using flip chip technology. Preferably, the outside of the tube is structured for being wetted at appropriate positions by the solder. This allows to assemble the sensor easily and accurately.
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