Resin composition
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United States of America Patent
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Aug 24, 2004
Grant Date -
N/A
app pub date -
Sep 15, 2000
filing date -
Mar 19, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A resin composition which comprises from 50 to 99.5 parts by weight of a polyphenylene sulfide and from 0.5 to 50 parts by weight of a fluorinated resin having a solidification temperature of at least 237.degree. C. when cooled at a cooling rate of 10.degree. C./min after melting in a nitrogen atmosphere at 330.degree. C., and from 0 to 250 parts by weight of a filler, etc. per 100 parts by weight of the two components.
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