Method for drilling holes in a substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6781092
SERIAL NO

10369623

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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When holes are being drilled in an electric circuit substrate, a laser beam is moved on concentric circular tracks in the region of the hole to be drilled. The transition from one circular track to the next takes place in each case on an arc that departs approximately tangentially from the circular track last traversed and nestles approximately tangentially against the circular track newly to be described in such a way that in each case the starting point of a new circular track is offset by a prescribed angle from the starting point of the preceding circular track.

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Patent Owner(s)

Patent OwnerAddress
VIA MECHANICS LTDKANAGAWA JAPAN KANAGAWA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Biesen, Marc Van Gent, BE 1 10
De, Steur Hubert Drongen, BE 17 201
Kilthau, Alexander Bad Schoenborn, DE 3 63
Kletti, Andre Sandhausen, DE 2 60
Mayer, Hans Juergen Viernheim, DE 7 93
Mitzinneck, Petra Karlsruhe, DE 2 12
Roelants, Eddy Brugge, BE 11 153
Thuerk, Oliver Graben-Neudorf, DE 1 10

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