Anti-tombstoning solder alloys for surface mount applications
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United States of America Patent
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Aug 31, 2004
Grant Date -
May 30, 2002
app pub date -
Sep 20, 2001
filing date -
Oct 18, 2000
priority date (Note) -
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Abstract
The object of this invention is to employ a solder alloy comprising tin/lead/silver in order to provide a wider solidification range and achieve balance between the surface tensions of both side of a small leadless component. The expanded solidification range slows the melting and wetting time so as to balance the surface tension of the molten solder, and in turn reduces the tombstoning frequency. The preferred Ag concentration is 0.2-0.5% in weight, the more preferred Ag concentration is 0.3-0.4% in weight. For reflow soldering of small leadless components, the pastes made with the alloy compositions of Sn62.6Pb37Ag0.4 and Sn63Pb36.6Ag0.4 results in improvements in tombstoning.
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