Low signal loss bonding ply for multilayer circuit boards
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United States of America Patent
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Aug 31, 2004
Grant Date -
Oct 30, 2003
app pub date -
May 29, 2003
filing date -
Sep 14, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
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