US Patent No: 6,784,020
Number of patents in Portfolio can not be more than 2000
Package structure and method for making the same
Stats
-
Aug 31, 2004
Issued date -
Oct 30, 2002
filing date -
10/283,129
serial no -
In Force
status
Importance
Loading Importance Indicators...
Abstract
A package structure and method for making devices of system-in-a-package (SiP). Substrates with integrated and assembled elements can be aligned and pre-bonded together, and fluidic encapsulating materials is applied to seal the rest opening of pre-bonded interface of substrates. Three dimensional and protruding microstructures, elements, and MFMS devices can be accommodated and protected inside a spatial space formed by the bonded substrates. By applying the technologies of flip-chip, chip-scale-packaging, and wafer-level-packaging in conjunction with present invention, then plural elements and devices can be packaged together and become a system device in wafer-level-system-in-a-package (WLSiP) format.
Loading the Abstract Image...
First Claim
Related Publications
Loading Related Publications...
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
|
|
|||
| 6,455,167 Coating system utilizing an oxide diffusion barrier for improved performance and repair capability | 20 | 1999 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 29, 2016 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |