Symmetric stack up structure for organic BGA chip carriers
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United States of America Patent
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Aug 31, 2004
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N/A
app pub date -
Aug 23, 2001
filing date -
Dec 8, 2000
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Abstract
An improved structure for an organic ball-grid array chip carrier having an organic substrate attached to a metal heat sink plate to prevent the chip carrier from warping. A supplemental organic substrate is attached to the metal heat sink plate on the side opposite from the functional organic substrate to provide symmetry to the bending forces resulting from the mismatch in coefficients of thermal expansion between the organic substrate and the metal heat sink plate.
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