Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
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United States of America Patent
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Aug 31, 2004
Grant Date -
Mar 27, 2003
app pub date -
Sep 17, 2001
filing date -
Sep 17, 2001
priority date (Note) -
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Abstract
Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening by using inorganic insulator particles having an average particle size of 1 .mu.m to 1000 .mu.m and a major axis to minor axis ratio of about 1.0 to 1.5.
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