Test signal distribution system for IC tester
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United States of America Patent
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Aug 31, 2004
Grant Date -
Nov 13, 2003
app pub date -
May 8, 2002
filing date -
May 8, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A probe board provides signal paths between an integrated circuit (IC) tester and probes accessing terminals on the surfaces of ICs formed on a semiconductor wafer for receiving test signals form the IC tester. A branching signal path within the probe board distributes a test signal produced by one channel of the IC tester to several probes. Resistors within the branching signal path resistively isolate the probes from one another so that a fault occurring at any one IC terminal will not affect the logic state of the test signal arriving at any other IC terminal. The isolation resistors are sized relative to signal path characteristic impedances so as to substantially minimize test signal reflections at the branch points.
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