Method and apparatus for wafer analysis
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United States of America Patent
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Aug 31, 2004
Grant Date -
Jan 16, 2003
app pub date -
Jul 13, 2001
filing date -
Jul 13, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention discloses method and apparatus for wafer analysis. First, a plurality of specific distribution maps, which respectively refer to a defect pattern distribution in a pattern group, is defined. Next, a plurality of distribution features is defined so that each specific distribution map correlates to one of the distribution features. Then, each pattern group on the wafer is compared to each specific distribution map in order to relate each pattern group to at least one of the specific distribution maps, and relate each pattern group on the wafer indirectly to at least one of the distribution features while allocating each distribution feature indirectly related to each pattern group with a respective relative value. Finally, the relative values of each distribution feature are totaled on the wafer respectively to obtain total values of the distribution features. With the method and apparatus disclosed in the present invention, it is easier to detect defective patterns on the wafer systematically and effectively.
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