Semiconductor device having a moveable member therein and a protective member disposed thereon
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United States of America Patent
Stats
-
Sep 7, 2004
Issued Date -
N/A
app pub date -
Mar 7, 2002
filing date -
Mar 19, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.
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