Semiconductor component with integrated circuit, cooling body, and temperature sensor
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United States of America Patent
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-
Sep 7, 2004
Grant Date -
Dec 11, 2003
app pub date -
May 23, 2003
filing date -
Jun 7, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor component with an integrated circuit has a cooling body as a heat sink and a temperature sensor thermally connected thereto, whose resistance is dependent on temperature. The temperature sensor contains a thin film measuring resistor, which is applied to an electrically insulating surface of a foil-like substrate, and the total thickness of the temperature sensor lies in a range of about 10 .mu.m to 100 .mu.m. The thin film measuring resistor is formed as a planar component, with the temperature sensor being arranged between the integrated circuit and the cooling body. The thin film measuring resistor is provided on one side with a thermal coupling layer bordering on the cooling body, while on the other side the resistor has a substrate bordering on a heat distributor, which at least partially surrounds the integrated circuit.
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