Wafer-level package with silicon gasket
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United States of America Patent
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Sep 7, 2004
Grant Date -
Jun 26, 2003
app pub date -
Dec 20, 2001
filing date -
Dec 20, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.
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