Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity
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United States of America Patent
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Sep 7, 2004
Grant Date -
Mar 13, 2003
app pub date -
Sep 13, 2001
filing date -
Sep 13, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Semiconductor dies are bonded to contact pads formed in a substrate's cavity. Vias through the substrate open into the cavity. Conductive lines passing through the vias connect the contact pads in the cavity to contact pads on another side of the substrate. A passage in the substrate opens into the cavity and provides an escape or pressure relief path for material filling the cavity. The passage can also be used to introduce material into the cavity.
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