Methodology and apparatus using real-time optical signal for wafer-level device dielectrical reliability studies
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United States of America Patent
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Sep 7, 2004
Grant Date -
Feb 12, 2004
app pub date -
Aug 7, 2002
filing date -
Aug 7, 2002
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Abstract
A method and structure tests devices on a wafer by applying an electrical bias to the devices and simultaneously monitoring emitted light from all of the devices. The emitted light indicates locations of defective devices and records time-based images of the emitted light across the wafer.
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