Method of statistical binning for reliability selection
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United States of America Patent
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Sep 7, 2004
Grant Date -
Jun 26, 2003
app pub date -
Dec 19, 2002
filing date -
Dec 26, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A statistical method is described for reliability selection of dies on semiconductor wafers using critical wafer yield parameters. This is combined with other data from the wafer or module level reliability screens (such as voltage screen or burn-in) to obtain the relative latent defect density. Finally the modeled results are compared with actual results to demonstrate confidence in the model.
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