Method of and apparatus for processing substrate
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United States of America Patent
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Sep 14, 2004
Grant Date -
Mar 28, 2002
app pub date -
Sep 25, 2001
filing date -
Sep 28, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
In a substrate processing apparatus for use in performing a reduced-pressure pull up drying method, a liquid drainage pipe (46) for draining a drainage liquid containing an organic solvent from a processing chamber (26) including therein a processing bath (10) for rinsing a substrate (W) with water is provided with a buffer tank (50) inserted therein for separation between the drainage liquid and an organic solvent vapor. A vapor discharge pipe (62) is connected in communication with an interior space of the buffer tank, and is provided with pressure regulating valves (64a, 64b) inserted therein for regulating pressure in the processing chamber at a fixed pressure higher than atmospheric pressure.
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