US Patent No: 6,790,597

Number of patents in Portfolio can not be more than 2000

Thermosetting resin compositions containing maleimide and/or vinyl compounds

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Abstract

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In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HENKEL CORPORATIONROCKY HILL, CT113

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dershem, Stephen M San Diego, CA 93 2644
Osuna, Jr Jose A Albany, OR 11 441
Patterson, Dennis B Palmdale, CA 17 516

Cited Art Landscape

Patent Info (Count) # Cites Year
 
WESTINGHOUSE ELECTRIC CORPORATION (2)
4,623,559 U.V. cured flexible polyester-monoacrylate protective thermistor coatings having good edge coverage and method of coating 24 1985
4,999,136 Ultraviolet curable conductive resin 64 1988
 
MINNESOTA MINING AND MANUFACTURING COMPANY (4)
4,621,122 High-temperature resistant electrically insulating coating powder 12 1985
4,904,360 Water-compatible coating composition 30 1988
* 5,314,513 Abrasive product having a binder comprising a maleimide binder 49 1992
* 5,405,686 Article coated with kured homogeneous thermoset resin/thermoplastic particles 17 1994
 
Other [Check patent profile for assignment information] (1)
H424 Method of synthesizing the bismaleimide of dimer diamine via cyclodehydration 6 1985
 
DSM RESINS BV, A NETHERLANDS CO. (1)
* 4,766,179 Bismaleimide compositions 10 1986
 
FREESCALE SEMICONDUCTOR, INC. (4)
5,006,673 Fabrication of pad array carriers from a universal interconnect structure 107 1989
5,011,066 Enhanced collapse solder interconnection 32 1990
5,186,383 Method for forming solder bump interconnections to a solder-plated circuit trace 90 1991
5,216,278 Semiconductor device having a pad array carrier package 589 1992
 
The Goodyear Tire & Rubber Company (2)
5,153,248 Sulfur vulcanized rubber compounds containing silica and aromatic bismaleimide 17 1991
5,328,636 Rubber vulcanization system containing bis-(2,5-polythio-1,3,4-thiadiazole), bismaleimide and sulfenamide 17 1993
 
BP CORPORATION NORTH AMERICA INC. (2)
5,364,700 Prepregable resin composition and composite 21 1985
* 4,853,449 Bismaleimide formulations containing olefinic ether modifiers 19 1988
 
THE DOW CHEMICAL COMPANY (4)
* 4,826,997 N-Substituted arylcyclo butenyl-maleimides 40 1986
4,743,642 Color balanced rubber-reinforced plastic 14 1986
5,206,321 Polycyanates containing mesogenic moieties as lateral substituents 10 1991
* 5,442,039 Mesogenic polycyanates and thermosets thereof 55 1993
 
SUMITOMO CHEMICAL COMPANY, LIMITED (2)
4,803,250 Rubber composition with bismaleimides 23 1987
4,980,436 Thermosetting resin composition from alkenyl aryloxy triazine compound and poly maleimide 13 1990
 
CIBA-GEIGY CORPORATION (1)
4,540,650 Photoresists suitable for forming relief structures of highly heat-resistant polymers 20 1983
 
NEC CORPORATION (1)
5,483,101 Multilayer printed circuit board 27 1994
 
HUNTSMAN ADVANCED MATERIALS AMERICAS INC. (3)
* 5,183,869 Hardenable compositions 7 1991
* 5,359,020 Hardenable compositions comprising bismaleimides, alkenylphenols and phenol diallyl ethers 11 1991
* 5,470,920 Impregnating solutions based on at least one reactive thermoplastic poly (imide-amide) oligomer and a coreactant, which can be used especially for the production of preimpregnated intermediate articles 10 1993
 
Thomas F. Roland NATIONAL STARCH AND CHEMICAL COMPANY P.O. Box 6500 (1)
4,581,461 Maleated siloxane derivatives 20 1983
 
MITSUI TOATSU CHEMICALS, INC. (1)
* 4,323,662 Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives 42 1980
 
DOW CORNING CORPORATION (1)
5,017,406 UV curable compositions cured with polysilane and peroxide initiators 19 1988
 
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (1)
* 4,740,830 Low temperature single step curing polyimide adhesive 23 1987
 
KABUSHIKI KAISHA TOSHIBA (3)
5,258,426 Semiconductor device encapsulant 16 1990
5,272,377 Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition 15 1991
* 5,536,970 Resin-encapsulated semiconductor device 39 1994
 
QUANUM MATERIALS, INC. (1)
* 5,489,641 Freeze resistant die-attach compositions 41 1993
 
LOCKHEED MARTIN CORPORATION (1)
5,380,768 Foam, Foam-resin composite and method of making a foam-resin composite 18 1993
 
DSM N.V. (1)
5,302,661 Continuous products made of thermosettable monomers 9 1991
 
MITSUBISHI GAS CHEMICAL COMPANY, INC. (4)
4,370,467 Curable resin composition from polyfunctional aromatic ester and maleimide compound 30 1980
* 4,369,302 Curable resin composition comprising cyanate ester and polyisocyanate 19 1980
* 4,740,343 Method for producing rigid resin molds 22 1987
5,252,355 Process for producing multilayered printed board 13 1991
 
HUNTSMAN CORPORATION (1)
* 4,876,358 Oxyethylene bismaleimide derivatives 18 1987
 
HADCO SANTA CLARA, INC. (1)
5,347,258 Annular resistor coupled with printed circuit board through-hole 105 1993
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
4,914,814 Process of fabricating a circuit package 102 1989
* 5,527,592 Multilayer article having a planarized outer layer comprising a toughened polycyanurate 17 1994
* 5,599,611 Prepreg and cured laminate fabricated from a toughened polycyanurate 18 1994
 
GENERAL ELECTRIC COMPANY (2)
4,485,218 Encapsulating composition for inductive devices containing elastomeric polybutadiene having predominate trans-1,4 configuration 16 1982
4,578,328 Photopatternable polyimide compositions and method for making 16 1984
 
CYTEC TECHNOLOGY CORP. (4)
* 4,876,153 Process for the preparation of cyanate resin-based prepregs and films which maintain their tack 19 1988
* 4,908,088 Extreme damage tolerant graphite composites and method of making same 26 1988
* 5,189,116 Extremely tough thermosetting bismaleimide resin systems 27 1989
5,314,950 Heat resistant resin composition comprising polymers of N-(substituted) maleimides and improved process for the preparation of said maleimides 21 1993
 
Huntsman Petrochemical Corporation (1)
4,826,995 Bismaleimide derivatives of higher molecular weight polyoxyalkyleneamines 13 1987
 
LOCTITE CORPORATION (4)
4,806,608 Curable siloxane maleimide composition 12 1987
* 4,886,842 Epoxy-amine compositions employing unsaturated imides 19 1989
* 5,358,992 Die-attach composition comprising polycyanate ester monomer 51 1993
* 5,447,988 Solvent free die-attach compositions 55 1993
 
Quantum Materials, Inc. (1)
* 5,789,757 Malemide containing formulations and uses therefor 18 1996
 
LORD CORPORATION (1)
5,475,048 Conductor-filled thermosetting resin 31 1993
 
HUGHES AIRCRAFT COMPANY (1)
4,613,637 Copolymers utilizing isoimides and method of preparing same 14 1983
 
MOTOROLA, INC. (1)
4,700,473 Method of making an ultra high density pad array chip carrier 100 1986
 
TREMCO INCORPORATED (1)
* 4,847,319 Sealant compositions or coating mixtures containing functional silane or siloxane adhesion promotors nonreactive with blocked isocyanates 21 1988
 
BAYER AKTIENGESELLSCHAFT (1)
4,663,424 Aromatic polyester with dimethylmaleimide end groups 30 1985
 
Union Carbide Corporation (1)
* 4,873,116 Method of preparing mixtures of incompatible hydrocarbon polymers 34 1986
 
North American Philips Corporation (1)
4,533,975 Radiation hardenable coating and electronic components coated therewith 29 1983
 
The United States of America as represented by the Secretary of the Navy (1)
* 4,564,663 Free radical cure of the bismaleimide of dimer diamine 7 1985
 
Dearborn Electronics, Inc. (1)
4,336,311 Humidity- and salt-resistant electronic component 21 1980
 
BASF AKTIENGESELLSCHAFT (1)
5,246,784 Ultrathin thermostable bismaleimide films and production thereof 7 1991
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
5,137,936 Method for packaging electronic parts and adhesive for use in said method 31 1990
 
AZ ELECTRONIC MATERIALS USA CORP. (1)
4,720,445 Copolymers from maleimide and aliphatic vinyl ethers and esters used in positive photoresist 26 1986
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
ZEPHYROS, INC. (5)
7,125,461 Activatable material for sealing, baffling or reinforcing and method of forming same 28 2003
7,199,165 Expandable material 41 2004
* 2005/0119,372 Two component (epoxy/amine) structural foam-in-place material 4 2004
8,070,994 Panel structure 12 2005
9,096,039 Structural composite laminates 0 2011
 
Designer Molecules Inc, Inc. (2)
8,686,162 Maleimide-functional monomers in amorphous form 0 2011
* 8,710,682 Materials and methods for stress reduction in semiconductor wafer passivation layers 0 2013
 
DESIGNER MOLECULES, INC. (42)
7,208,566 Imide-linked maleimide and polymaleimide compounds 30 2004
* 2004/0225,026 Imide-linked maleimide and polymaleimide compounds 10 2004
7,285,613 Free-radical curable polyesters and methods for use thereof 30 2005
* 2005/0272,888 Free-radical curable polyesters and methods for use thereof 7 2005
7,795,362 Olefin oligomers containing pendant maleimide groups 9 2005
* 2006/0142,517 Olefin oligomers containing pendant maleimide groups 27 2005
8,378,017 Thermosetting adhesive compositions 1 2006
* 2007/0155,869 Mono-functional monomers and methods for use thereof 27 2006
7,884,174 Imide-linked maleimide and polymaleimide compounds 9 2007
7,868,113 Low shrinkage polyester thermosetting resins 9 2007
8,043,534 Maleimide compositions and methods for use thereof 9 2007
8,530,573 Modified calcium carbonate-filled adhesive compositions and methods for use thereof 1 2007
8,287,686 Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof 1 2007
* 2008/0017,308 Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof 27 2007
7,875,688 Free-radical curable polyesters and methods for use thereof 9 2007
7,786,234 Free-radical curable polyesters and methods for use thereof 9 2007
* 2008/0191,173 Free-radical curable polyesters and methods for use thereof 27 2007
8,344,076 Hydrolytically resistant thermoset monomers 2 2007
7,825,188 Thermoplastic elastomer with acyloxyphenyl hard block segment 1 2007
* 2008/0142,158 HYDROLYTICALLY RESISTANT THERMOSET MONOMERS 27 2007
8,039,663 Monomers derived from pentacyclopentadecane dimethanol 9 2008
8,063,161 Low temperature curing acrylate and maleimide based formulations and methods for use thereof 2 2008
7,928,153 Thermosetting polyether oligomers, compositions and methods for use thereof 10 2008
8,398,898 Soluble metal salts for use as conductivity promoters 1 2009
8,541,531 Anti-bleed compounds, compositions and methods for use thereof 1 2009
8,308,892 Di-cinnamyl compounds and methods for use thereof 1 2009
8,637,611 Amide-extended crosslinking compounds and methods for use thereof 1 2009
8,217,120 Functionalized styrene oligomers and polymers 1 2009
8,158,748 Hetero-functional compounds and methods for use thereof 1 2009
8,013,104 Thermosetting hyperbranched compositions and methods for use thereof 9 2009
8,008,419 Siloxane monomers and methods for use thereof 9 2009
* 2010/0041,803 THERMOSETTING HYPERBRANCHED COMPOSITIONS AND METHODS FOR USE THEREOF 28 2009
* 2010/0041,823 NOVEL SILOXANE MONOMERS AND METHODS FOR USE THEREOF 27 2009
* 2010/0041,832 FUNCTIONALIZED STYRENE OLIGOMERS AND POLYMERS 27 2009
8,288,591 Curing agents for epoxy resins 1 2009
* 2010/0144,977 CURING AGENTS FOR EPOXY RESINS 9 2009
8,431,655 Curatives for epoxy compositions 2 2010
8,415,812 Materials and methods for stress reduction in semiconductor wafer passivation layers 2 2010
8,513,375 Imide-linked maleimide and polymaleimide compounds 1 2011
8,816,021 Curable composition with rubber-like properties 0 2011
* 2013/0228,901 MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS 1 2013
9,278,909 Amide-extended crosslinking compounds and methods for use thereof 0 2013
 
SCHLUMBERGER TECHNOLOGY CORPORATION (1)
* 2009/0200,013 WELL TUBULAR, COATING SYSTEM AND METHOD FOR OILFIELD APPLICATIONS 2 2009
* Cited By Examiner

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