Thermosetting resin compositions containing maleimide and/or vinyl compounds

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6790597
APP PUB NO 20030087999A1
SERIAL NO

10211168

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HENKEL CORPORATIONROCKY HILL, CT104

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dershem, Stephen M San Diego, CA 93 2676
Osuna, Jr Jose A Albany, OR 11 444
Patterson, Dennis B Palmdale, CA 17 518

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Westinghouse Electric Corp. (2)
4623559 U.V. cured flexible polyester-monoacrylate protective thermistor coatings having good edge coverage and method of coating 24 1985
4999136 Ultraviolet curable conductive resin 66 1988
 
Minnesota Mining and Manufacturing Company (4)
4621122 High-temperature resistant electrically insulating coating powder 12 1985
4904360 Water-compatible coating composition 30 1988
* 5314513 Abrasive product having a binder comprising a maleimide binder 55 1992
* 5405686 Article coated with kured homogeneous thermoset resin/thermoplastic particles 17 1994
 
Other [Check patent profile for assignment information] (1)
H424 Method of synthesizing the bismaleimide of dimer diamine via cyclodehydration 6 1985
 
DSM RESINS BV (1)
* 4766179 Bismaleimide compositions 10 1986
 
FREESCALE SEMICONDUCTOR, INC. (4)
5006673 Fabrication of pad array carriers from a universal interconnect structure 107 1989
5011066 Enhanced collapse solder interconnection 32 1990
5186383 Method for forming solder bump interconnections to a solder-plated circuit trace 90 1991
5216278 Semiconductor device having a pad array carrier package 601 1992
 
The Goodyear Tire & Rubber Company (2)
5153248 Sulfur vulcanized rubber compounds containing silica and aromatic bismaleimide 17 1991
5328636 Rubber vulcanization system containing bis-(2,5-polythio-1,3,4-thiadiazole), bismaleimide and sulfenamide 17 1993
 
BP CORPORATION NORTH AMERICA INC. (2)
5364700 Prepregable resin composition and composite 21 1985
* 4853449 Bismaleimide formulations containing olefinic ether modifiers 19 1988
 
THE DOW CHEMICAL COMPANY (4)
* 4826997 N-Substituted arylcyclo butenyl-maleimides 40 1986
4743642 Color balanced rubber-reinforced plastic 14 1986
5206321 Polycyanates containing mesogenic moieties as lateral substituents 10 1991
* 5442039 Mesogenic polycyanates and thermosets thereof 68 1993
 
SUMITOMO CHEMICAL COMPANY, LIMITED (2)
4803250 Rubber composition with bismaleimides 23 1987
4980436 Thermosetting resin composition from alkenyl aryloxy triazine compound and poly maleimide 13 1990
 
Ciba-Geigy Corporation (1)
4540650 Photoresists suitable for forming relief structures of highly heat-resistant polymers 20 1983
 
NEC CORPORATION (1)
5483101 Multilayer printed circuit board 28 1994
 
Huntsman Advanced Materials Americas Inc. (3)
* 5183869 Hardenable compositions 7 1991
* 5359020 Hardenable compositions comprising bismaleimides, alkenylphenols and phenol diallyl ethers 11 1991
* 5470920 Impregnating solutions based on at least one reactive thermoplastic poly (imide-amide) oligomer and a coreactant, which can be used especially for the production of preimpregnated intermediate articles 10 1993
 
National Starch and Chemical Company (1)
4581461 Maleated siloxane derivatives 20 1983
 
Mitsui Toatsu Chemicals, Incorporated (1)
* 4323662 Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives 42 1980
 
DOW CORNING CORPORATION (1)
5017406 UV curable compositions cured with polysilane and peroxide initiators 19 1988
 
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (1)
* 4740830 Low temperature single step curing polyimide adhesive 23 1987
 
KABUSHIKI KAISHA TOSHIBA (3)
5258426 Semiconductor device encapsulant 16 1990
5272377 Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition 15 1991
* 5536970 Resin-encapsulated semiconductor device 40 1994
 
QUANUM MATERIALS, INC. (1)
* 5489641 Freeze resistant die-attach compositions 41 1993
 
LOCKHEED MARTIN CORPORATION (1)
5380768 Foam, Foam-resin composite and method of making a foam-resin composite 18 1993
 
DSM N.V. (1)
5302661 Continuous products made of thermosettable monomers 9 1991
 
MITSUBISHI GAS CHEMICAL COMPANY, INC. (4)
4370467 Curable resin composition from polyfunctional aromatic ester and maleimide compound 30 1980
* 4369302 Curable resin composition comprising cyanate ester and polyisocyanate 19 1980
* 4740343 Method for producing rigid resin molds 22 1987
5252355 Process for producing multilayered printed board 13 1991
 
HUNTSMAN CORPORATION (1)
* 4876358 Oxyethylene bismaleimide derivatives 18 1987
 
HADCO SANTA CLARA, INC. (1)
5347258 Annular resistor coupled with printed circuit board through-hole 105 1993
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
4914814 Process of fabricating a circuit package 102 1989
* 5527592 Multilayer article having a planarized outer layer comprising a toughened polycyanurate 17 1994
* 5599611 Prepreg and cured laminate fabricated from a toughened polycyanurate 18 1994
 
GENERAL ELECTRIC COMPANY (2)
4485218 Encapsulating composition for inductive devices containing elastomeric polybutadiene having predominate trans-1,4 configuration 16 1982
4578328 Photopatternable polyimide compositions and method for making 17 1984
 
Cytec Technology Corp. (4)
* 4876153 Process for the preparation of cyanate resin-based prepregs and films which maintain their tack 19 1988
* 4908088 Extreme damage tolerant graphite composites and method of making same 26 1988
* 5189116 Extremely tough thermosetting bismaleimide resin systems 28 1989
5314950 Heat resistant resin composition comprising polymers of N-(substituted) maleimides and improved process for the preparation of said maleimides 21 1993
 
HUNTSMAN PETROCHEMICAL CORPORATION (1)
4826995 Bismaleimide derivatives of higher molecular weight polyoxyalkyleneamines 13 1987
 
LOCTITE CORPORATION (4)
4806608 Curable siloxane maleimide composition 12 1987
* 4886842 Epoxy-amine compositions employing unsaturated imides 19 1989
* 5358992 Die-attach composition comprising polycyanate ester monomer 51 1993
* 5447988 Solvent free die-attach compositions 55 1993
 
QUANTUM MATERIALS, INC. (1)
* 5789757 Malemide containing formulations and uses therefor 23 1996
 
LORD CORPORATION (1)
5475048 Conductor-filled thermosetting resin 31 1993
 
HUGHES AIRCRAFT COMPANY (1)
4613637 Copolymers utilizing isoimides and method of preparing same 14 1983
 
MOTOROLA, INC. (1)
4700473 Method of making an ultra high density pad array chip carrier 101 1986
 
Tremco Incorporated (1)
* 4847319 Sealant compositions or coating mixtures containing functional silane or siloxane adhesion promotors nonreactive with blocked isocyanates 22 1988
 
BAYER AKTIENGESELLSCHAFT (1)
4663424 Aromatic polyester with dimethylmaleimide end groups 30 1985
 
UNION CARBIDE CORPORATION (1)
* 4873116 Method of preparing mixtures of incompatible hydrocarbon polymers 34 1986
 
North American Philips Corporation (1)
4533975 Radiation hardenable coating and electronic components coated therewith 29 1983
 
The United States of America as represented by the Secretary of the Navy (1)
* 4564663 Free radical cure of the bismaleimide of dimer diamine 7 1985
 
DEARBORN ELECTRONICS INC. (1)
4336311 Humidity- and salt-resistant electronic component 21 1980
 
BASF AKTIENGESELLSCHAFT (1)
5246784 Ultrathin thermostable bismaleimide films and production thereof 7 1991
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
5137936 Method for packaging electronic parts and adhesive for use in said method 31 1990
 
AZ ELECTRONIC MATERIALS USA CORP. (1)
4720445 Copolymers from maleimide and aliphatic vinyl ethers and esters used in positive photoresist 26 1986
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
L&L PRODUCTS, INC. (1)
* 2005/0020,703 Two component (epoxy/amine) structural foam-in-place material 7 2004
 
ZEPHYROS, INC. (7)
7125461 Activatable material for sealing, baffling or reinforcing and method of forming same 32 2003
7199165 Expandable material 46 2004
* 2005/0119,372 Two component (epoxy/amine) structural foam-in-place material 5 2004
8070994 Panel structure 14 2005
9427902 Cavity filling 0 2010
9096039 Structural composite laminates 0 2011
9688050 Panel structure 0 2011
 
Designer Molecules Inc, Inc. (2)
8686162 Maleimide-functional monomers in amorphous form 0 2011
* 8710682 Materials and methods for stress reduction in semiconductor wafer passivation layers 0 2013
 
DESIGNER MOLECULES, INC. (42)
7208566 Imide-linked maleimide and polymaleimide compounds 31 2004
* 2004/0225,026 Imide-linked maleimide and polymaleimide compounds 10 2004
7285613 Free-radical curable polyesters and methods for use thereof 30 2005
* 2005/0272,888 Free-radical curable polyesters and methods for use thereof 7 2005
7795362 Olefin oligomers containing pendant maleimide groups 9 2005
* 2006/0142,517 Olefin oligomers containing pendant maleimide groups 27 2005
8378017 Thermosetting adhesive compositions 1 2006
* 2007/0155,869 Mono-functional monomers and methods for use thereof 27 2006
7884174 Imide-linked maleimide and polymaleimide compounds 9 2007
7868113 Low shrinkage polyester thermosetting resins 9 2007
8043534 Maleimide compositions and methods for use thereof 9 2007
8530573 Modified calcium carbonate-filled adhesive compositions and methods for use thereof 1 2007
8287686 Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof 1 2007
* 2008/0017,308 Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof 28 2007
7875688 Free-radical curable polyesters and methods for use thereof 9 2007
7786234 Free-radical curable polyesters and methods for use thereof 9 2007
* 2008/0191,173 Free-radical curable polyesters and methods for use thereof 27 2007
8344076 Hydrolytically resistant thermoset monomers 2 2007
7825188 Thermoplastic elastomer with acyloxyphenyl hard block segment 1 2007
* 2008/0142,158 HYDROLYTICALLY RESISTANT THERMOSET MONOMERS 27 2007
8039663 Monomers derived from pentacyclopentadecane dimethanol 9 2008
8063161 Low temperature curing acrylate and maleimide based formulations and methods for use thereof 2 2008
7928153 Thermosetting polyether oligomers, compositions and methods for use thereof 10 2008
8398898 Soluble metal salts for use as conductivity promoters 1 2009
8541531 Anti-bleed compounds, compositions and methods for use thereof 1 2009
8308892 Di-cinnamyl compounds and methods for use thereof 1 2009
8637611 Amide-extended crosslinking compounds and methods for use thereof 1 2009
8217120 Functionalized styrene oligomers and polymers 1 2009
8158748 Hetero-functional compounds and methods for use thereof 1 2009
8013104 Thermosetting hyperbranched compositions and methods for use thereof 9 2009
8008419 Siloxane monomers and methods for use thereof 9 2009
* 2010/0041,803 THERMOSETTING HYPERBRANCHED COMPOSITIONS AND METHODS FOR USE THEREOF 28 2009
* 2010/0041,823 NOVEL SILOXANE MONOMERS AND METHODS FOR USE THEREOF 27 2009
* 2010/0041,832 FUNCTIONALIZED STYRENE OLIGOMERS AND POLYMERS 27 2009
8288591 Curing agents for epoxy resins 1 2009
* 2010/0144,977 CURING AGENTS FOR EPOXY RESINS 10 2009
8431655 Curatives for epoxy compositions 2 2010
8415812 Materials and methods for stress reduction in semiconductor wafer passivation layers 2 2010
8513375 Imide-linked maleimide and polymaleimide compounds 1 2011
8816021 Curable composition with rubber-like properties 0 2011
* 2013/0228,901 MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS 2 2013
9278909 Amide-extended crosslinking compounds and methods for use thereof 0 2013
 
SCHLUMBERGER TECHNOLOGY CORPORATION (1)
* 2009/0200,013 WELL TUBULAR, COATING SYSTEM AND METHOD FOR OILFIELD APPLICATIONS 4 2009
* Cited By Examiner